Tuesday, 10 June 2014

PRESENTATION DAY..........

WEEK 28

8.00 am 

Today is my presentation day, i will do my best for my presentation .

2.00 pm

Finally i had success present my final year projects and there are recommendation that given by the accessor to improved my projects but im really happy because i do it well 



PRESENT TO SUPERVISOR

WEEK 27


After testing about my circuit, all the components had been troubleshooting properly and ALHAMDULLILAH  overall the circuit had been run properly but its take about a week to troubleshooting the circuit before it can work properly according the flow chart . The objective that i need to achived in this week is to present the circuit to my supervisor SIR IZWAN ARIEF . And before going for testingi had prepared the mini video about my projects and had been upload above. From the video below had shown on how my circuit  was operated . 


TESTING PART

WEEK 26

After all the soldering process had been done , the next stage is to testing the circuit. Before testing process, all the components  needed had been assemble together before testing. There are motor with ultrasonic sensor, there adapter acts as the battery inside the car .







SOLDERING PROCESS

WEEK 25

After finished the etching process, the next part is about soldering the components on the PCB according the design. Solder needs a clean surface on which to adhere. Buff the copper foil of a PC board with steel wool before soldering. Remove any oil, paint, wax, etc. with a solvent, steel wool, or fine sandpaper. To solder, heat the connection with the tip of the soldering iron for a few seconds, then apply the solder. Open circuit can be troubleshoot by using jumper wire to make the connection between two traces. After all tracks are repaired properly. 


ETCHING PROCESS

WEEK 24

5 week to goooo.....!!! 
In this week, the objective that need to be achieved in this week is to make sure that the etching process had been done. The first step in this week and to complete the first objective in this week is to produced the PCB board and the etching process must be done. Below picture shown the step by step in developing the PCB 


Step 1: Prepare a layout of the circuit on any commonly used PCB designing software. A layout is a design which interconnects the components according to the schematic diagram (circuit diagram). Take a mirror image print of the layout on the OHP sheet using a laser printer. Make sure that the design is correct with proper placement of the components

Step 2: Cut the copper board according to the size of layout. A copper board is the base of a PCB, it can be single layer, double layer or multi layer board. Single layer copper board has copper on one side of the PCB, they are used to make single layer PCBs, it is widely used by hobbyist or in the small circuits. A double layer copper board consists of copper on both the sides of the PCB. These boards are generally used by the industries. A multilayer board has multiple layers of copper; they are quite costly and mainly used for complex circuitries like mother board of PC.

Step 3: Rub the copper side of PCB using steel wool. This removes the top oxide layer of copper as well as the photo resists layer if any.


Step 4: Put a white paper on the OHP sheet and start ironing. The heat applied by the electric iron causes the ink of the traces on the OHP sheet to stick on the copper plate exactly in the same way it is printed on the OHP sheet. This means that the copper sheet will now have the layout of the PCB printed on it. Allow the PCB plate to cool down and slowly remove the OHP sheet. Since it is manual process it may happen that the layout doesn’t comes properly on PCB or some of the tracks are broken in between. Use the permanent marker and complete the tracks properly.


Step 5: Take a plastic box and fill it up with some water. Dissolve 2-3 tea spoon of ferric chloride power in the water. Dip the PCB into the Etching solution (Ferric chloride solution, Fecl3) for approximately 30 mins. The Fecl3 reacts with the unmasked copper and removes the unwanted copper from the PCB. This process is called as Etching





Step 6: Take out the PCB wash it in cold water and remove the ink. The remaining area which has not been etched is the conductive copper tracks which connect the components as per the circuit diagram.

Step 8: Once all the copper is gone rinse it in the water bath, let it dry and use rubbing alcohol to whip off the ink transfered onto the PCB and PCB already DONE!!


DESIGN PCB

WEEK 23 

After the circuit on the breadboard had successfully develop and all the components had successfull troubleshooting , the next step is to design the circuit for PCB by using the PCB express software and all the copmonents had been develop according the circuit before . The below picture show that the PCB EXPRESS software 



The result of the circuit had been printed on the OHP paper for etching process. Below figure show that the result after designing and printing the circuit


HARDWARE DEVELOPMENT

WEEK 22

After finding the basic circuit  for hardware connection, I had develop the circuit on the breadboard before proceed to develop the circuit on the PCB. There are problems in part of LCD and motor development but the circuit had been troubleshoot to eliminate the problems.



 Before  testing the circuit at the bradboard, the PIC need to be burned with the program to know whether the circuit can operate according the function that I  need . The program need to be burned by using PICkit 2 Programmer .